
SFCOAT MP Series is a next-generation fluorine-free moisture-proof coating agent developed as a PFAS regulation countermeasure type for protecting electronic assemblies from moisture-related failures. SFCOAT MP Series forms an extremely thin protective layer while delivering high moisture resistance, making it suitable for electronics where dimensional tolerance, weight control and fine circuit geometries are critical.
Designed for modern manufacturing lines, SFCOAT MP Series offers quick drying at room temperature, reducing or eliminating the need for oven drying in many applications
In addition, SFCOAT MP Series is positioned as a non-flammable / non-ignitable coating system (catalogue: “non-flammability”), supporting safer handling in production environments.
SFCOAT MP Series is applicable across a broad range of substrates—including metals and plastics—and is intended for wide electronics and industrial moisture-proofing uses.
Hybrid polysilazane–fluoropolymer based electronic protective coating offering moisture resistance, chemical durability and excellent electrical insulation.
~95%
0.95 – 0.99 g/cm³
Clear to slightly opalescent liquid
Thin, dense, hydrophobic protective layer. Regulatory & Identification Details
3208
Classified as dangerous goods under transport conditions
SFCOAT MP Series is intended for various moisture-proofing applications, especially where the coating must be thin, fast-drying and compatible with different substrates. Typical use areas include:
For electronic parts, assemblies and sensitive zones where moisture exposure can cause insulation degradation, corrosion or performance drift.
Suitable for components combining metal and plastic parts, where broad substrate applicability is required.
Recommended for processes needing rapid drying at room temperature to improve throughput and reduce energy consumption.
| Property | Typical Value |
|---|---|
| Effective Ingredient | Fluorine-free |
| Solvent | MP Solvent |
| Viscosity (25 °C) | ~1.5 mPa·s |
| Flash Point | None (estimated from similar product) |
| Film Thickness | < 1 µm |
| Decomposition Temperature | ≥ 200 °C |
| UN Class | Not assigned |