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Boron Nitride Cooling Fillers are premium inorganic fillers with exceptionally high thermal conductivity, low dielectric loss, and excellent thermal shock resistance. Engineered for use in thermal interface materials (TIMs), heat sinks, thermal pastes, potting compounds, and high-performance polymers, these fillers enhance heat transfer, reduce hot spots, and improve overall thermal management in electronic, automotive, and industrial applications.
Unlike conventional ceramic fillers, boron nitride exhibits a unique combination of thermal conductivity and electrical insulation, making it ideal for demanding electronic and electrical thermal management solutions. Its plate-like structure provides anisotropic heat dissipation, allowing formulators to tailor thermal pathways based on application needs.
Available in multiple grades and particle size distributions, Boron Nitride Cooling Fillers can be optimized for high-loading dispersion in polymers, adhesives, coatings, and elastomers without significantly compromising mechanical properties or processability. These fillers support lightweight designs and enable performance improvements in next-generation thermal materials.
With excellent chemical stability and high temperature tolerance, boron nitride fillers maintain performance at elevated temperatures, making them suitable for power electronics, LED lighting, battery packs, and thermal interface applications. Their inert nature also ensures compatibility with most resins and matrix systems used in advanced thermal management formulations.
A high-purity, ultra-fine h-BN powder (1–5 μm) engineered for advanced thermal, lubrication, and coating applications. Its optimized particle size delivers exceptional heat transfer, smooth surface finish, and outstanding dispersion.
A high-purity, fine h-BN powder (10–15 μm) designed for demanding thermal, lubrication, and coating applications. Its balanced particle size offers excellent thermal conductivity, superior surface slip, and consistent dispersion
A high-purity, coarse h-BN powder (30–100 μm) engineered for applications requiring enhanced thermal conduction, high-temperature stability, and superior lubricity. Its larger particle structure delivers excellent heat dissipation, reduced friction, and improved wear resistance
A high-purity, extra-coarse h-BN powder (100–200 μm) designed for extreme thermal and tribological performance. Its robust particle structure provides exceptional heat dissipation, outstanding high-temperature stability, and superior dry lubricity
A premium water-based Boron Nitride coating containing 30% active h-BN dispersed in a durable alumina binder. This white, ready-to-use coating delivers exceptional non-wetting behavior, high-temperature stability, and superior lubrication on metal, ceramic, and graphite surfaces.
A blue-colored, high-performance Boron Nitride coating formulated with a strong alumina-based binder to deliver excellent non-wetting, high-temperature lubrication, and clean-release properties. The coating provides outstanding protection against molten metal adhesion, oxidation, and wear on metal, graphite, and ceramic substrates.
Efficiently dissipates heat (up to 300 W/m·K) for high-performance electronic applications.
Maintains strong dielectric strength, ideal for semiconductors and battery modules.
Offers excellent processability and weight reduction compared to metal-oxide fillers.
Enhances flowability and mold release during polymer compound! Why Choose Boron Nitride Cooling Fillers?
Maintains strong dielectric strength, ideal for semiconductors and battery modules.
Resistant to acids, alkalis, and oxidation — ensuring long-term stability.
A safe, sustainable alternative to traditional thermally conductive additives.
Thermally Conductive Plastics & Elastomers Improve cooling efficiency in LEDs, EV components, sensors, and electronic housings.
Thermal Interface Materials (TIMs) Create stable, high-performance greases, pads, and adhesives with superior heat dissipation.
Encapsulants & Potting Compounds Protect sensitive circuits and power modules from overheating and electrical stress.
Battery & EV Cooling Systems Enhance thermal diffusion and safety in lithium-ion battery packs and control units.
Ceramic Composites & Coatings Reinforce materials exposed to high temperatures and harsh operating environments.
BN offers up to 20× better heat transfer and smoother finish.
BN gives similar thermal performance with lighter weight and easier processing.
BN provides balanced performance with better stability.
BN transfers heat while remaining a perfect insulator.
BN achieves uniform dispersion and insulation.
BN adds heat management, lubrication, and reflectivity instead.
BN adds lubricity and high-temperature stability.
BN remains inert, non-hygroscopic, and process-friendly.
BN provides similar durability at lower weight and easier dispersion.
BN delivers non-conductive, corrosion-free cooling.
High in-plane thermal conductivity + excellent dielectric strength.
Applications: LED drivers, EV battery module potting, CPU thermal greases.
Boosts k-value without adding electrical conductivity; lightweight.
Applications: Polyamide/PP housings, sensor brackets, silicone gaskets.
Chemically inert, non-wetting to Al/Mg/Zn; superb lubricity.
Applications: BN spray on casting dies, glass forming, rubber demolding.
Graphite-like slip but non-carbon, works in vacuum/oxidizing atmospheres.
Applications: Aerospace mechanisms, oven chains, metal forming.
Thermal shock resistance, oxidation resistance, non-wetting behavior.
Applications: BN-coated ladles, crucibles for Al/Mg melts, foundry mold wash.
Low dielectric loss, machinability, thermal stability.
Applications: Microwave components, RF fixtures, insulator rings.
Atomically smooth, chemically clean, wide bandgap dielectric.
Applications: h-BN substrate/encapsulation for graphene/MoS₂ devices.
Silky slip, soft-focus/matte feel, oil absorption, whiteness.
Applications xample: Primers, powders, lipsticks, sunscreens.
Lubricity + heat dissipation; anti-stick on hot tooling.
Applications: BN in high-temp coatings for welding nozzles, molds.
Reduces friction/wear under pressure/heat; chemically inert.
Applications: Extreme-pressure lubricant additive for thread-making, valves.
Thermal pathway + electrical insulation; chemical stability.
Applications xample: Separators/coatings, potting for BMS/IGBT modules.
Wide bandgap, UV transparency; thermal stability.
Applications: Deep-UV device encapsulation/insulation layers (niche/R&D).
Why: Second only to diamond in hardness; superior for ferrous alloys where diamond reacts.
Applications: PCBN inserts for hardened steel, cast iron finishing.
Why: Maintains edge at high temps, minimal chemical wear.
Applications: Camshaft grinding, gear finishing.
| Grade | Purity (B+N) | Oxygen (O₂) | Carbon (C) | Boric Oxide (B₂O₃) | Metallic Impurities | Particle Size | Specific Surface (BET) | Shape of BN |
|---|---|---|---|---|---|---|---|---|
| GPBN-1300 | > 99% | ~0.5% | ~0.05% | < 0.3% | < 0.2% | 1–3 μm | 6–8 m²/g | Hexagonal Platelets |
| GPBN-4800 | > 99% | ~0.4% | ~0.05% | < 0.25% | < 0.2% | 4–8 μm | 3–8 m²/g | Hexagonal Platelets |
| GPBN-1013 | > 99% | ~0.6% | ~0.05% | < 0.3% | ~0.18% | 10–13 μm | 2–7 m²/g | Hexagonal Platelets |
| GPBN-1520 | > 99% | ~0.3% | ~0.03% | < 0.3% | ~0.2% | 15–20 μm | 2–5 m²/g | Hexagonal Platelets |
| GPBN-2830 | > 99% | ~0.4% | ~0.03% | < 0.3% | ~0.2% | 28–30 μm | 2–5 m²/g | Hexagonal Platelets |
| GPBN-3010 | > 99% | ~0.22% | ~0.01% | < 0.05% | < 0.1% | 30–100 μm | 3–4 m²/g | Hexagonal Flakes |
| GPBN-10150 | > 99% | ~0.47% | ~0.01% | < 0.05% | < 0.1% | 100–150 μm | 2–3 m²/g | Hexagonal Flakes |
| GPBN-7090 | > 98.5% | ~1% | ~0.03% | < 0.5% | < 0.2% | 7–9 μm | 3–7 m²/g | Hexagonal Platelets |
| Grade | Color | BN% | Carrier | Binder | pH | Viscosity (cps) | Specific Gravity (g/cc) | Max Temp of Use (°C) |
|---|---|---|---|---|---|---|---|---|
| GPBN-WB | White | 20–30% | Water | Alumina | 5.5–8.0 | 10,000–20,000 | 1.2 | 850 |
| GPBN-BL | Blue | 20–30% | Water | Alumina | 5.5–8.0 | 10,000–20,000 | 1.2 | 1370 |
At Geocon, we bridge the worlds of chemistry and biotechnology to create smarter, more sustainable solutions for industries worldwide. Our mission is to redefine performance — from advanced materials and enzyme technologies to clean chemistry innovations that drive progress and care for the planet.
At Geocon, we bridge the worlds of chemistry and biotechnology to create smarter,
more sustainable solutions for industries worldwide. Our mission is to redefine performance — from advanced materials and enzyme technologies to clean chemistry innovations that drive progress and care for the planet.