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PZ - 1000

PZ-1000 is a high-performance electronic protective coating formulated using advanced hybrid polysilazane and fluoropolymer chemistry, specifically engineered for the long-term protection of sensitive electronic assemblies. 

The unique molecular architecture enables the formation of a dense, inorganic-organic network upon curing, delivering exceptional barrier properties against moisture, chemicals, dust and environmental contaminants.

The polysilazane backbone converts into a silica-like structure after curing, providing excellent thermal stability and dielectric performance, while the fluoropolymer component imparts superior hydrophobicity, oleophobicity and low surface energy. This dual-chemistry approach ensures uniform film formation, excellent adhesion to diverse substrates and reliable protection under harsh operating conditions.

PZ-1000 is designed for modern electronics requiring thin, defect-free, high-reliability coatings without compromising electrical performance, making it suitable for both industrial and high-value electronic applications.

General Characteristics

Synonyms

Hybrid polysilazane–fluoropolymer based electronic protective coating offering moisture resistance, chemical durability and excellent electrical insulation.

Non-Volatile Matter

~95%

 

Density (25 °C)

0.95 – 0.99 g/cm³

Appearance

Clear to slightly opalescent liquid

Film Type

Thin, dense, hydrophobic protective layer. Regulatory & Identification Details

HS Code

3208

UN Class

Classified as dangerous goods under transport conditions

Applications

Electronic & Electrical Protection

PZ-1000 is widely used as a protective coating for printed circuit boards (PCBs), offering effective insulation against humidity, condensation and corrosive environments. It penetrates micro-gaps and fine circuitry, ensuring uniform coverage even on densely populated boards.

Conformal & Thin-Film Coatings

Ideal for applications where thin, non-PFA, low-weight coatings are required without altering component tolerances. The coating forms a continuous barrier while maintaining signal integrity and dielectric reliability.

Sensors & Microelectronics

Used for protecting sensors, connectors and miniaturized electronic components where resistance to moisture ingress, oils and airborne contaminants is critical for long-term performance.

Industrial & Harsh Environment Electronics

Suitable for electronics exposed to temperature variations, mild chemicals, dust and industrial atmospheres, enhancing operational life and reducing failure rates.

Parameter Specification
Product Type Hybrid Polysilazane Electronic Coating
Appearance Clear to slightly opalescent liquid
Chemical Nature Inorganic–organic hybrid
Non-Volatile Matter ~95 %
Density (25 °C) 0.95 – 0.99 g/cm³
Viscosity (25 °C) Low viscosity, flowable liquid (suitable for spray / dip / brush)
Solvent System Low-solvent / high-solids formulation
Film Formation Thin, continuous, dense protective layer
Typical Dry Film Thickness 1 – 5 µm (single coat, application dependent)
Surface Energy Very low (hydrophobic & oleophobic surface)
Water Contact Angle >100° (after curing)
Dielectric Strength Excellent electrical insulation properties
Pencil Hardness ≥ 5H
Volume Resistivity High (suitable for electronic protection)
Thermal Stability Stable up to ~250 °C (post-cure)
Adhesion Excellent on metals, ceramics, glass, PCB substrates & polymers
Chemical Resistance Resistant to moisture, mild acids, alkalis, oils & solvents
Cure Mechanism Moisture / thermal assisted inorganic network formation
Operating Temperature Range –40 °C to +200 °C
Shelf Life 12 months (when stored as recommended)

Key Properties

Low surface energy for effective contaminant resistance

Dense inorganic-organic network after curing

High thermal stability compared to conventional organic coatings

Excellent chemical and corrosion resistance

Uniform film formation with good flow and levelling

Benefits

Excellent moisture, humidity and condensation resistance

Superior hydrophobic and oleophobic surface properties

High dielectric strength with minimal impact on electrical signals

Thin-film protection without adding bulk or weight

Strong adhesion to metals, ceramics, glass and polymer substrates

Improved reliability and service life of electronic assemblies

Safety & Hazard Information

Handle with standard industrial safety practices

Use adequate ventilation during application

Avoid prolonged skin contact; wear protective gloves and eyewear

Refer to the Safety Data Sheet (SDS) for detailed handling guidelines

Storage & Handling Guidelines

Store in a cool, dry place away from direct sunlight

Keep containers tightly closed when not in use

Recommended storage temperature: 5 °C – 30 °C

Avoid exposure to moisture during storage

Packaging Information

1 Liter Cans

5 Liter Cans

25 Liter Cans

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