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Electronics coatings and encapsulants must maintain strong adhesion under thermal cycling, humidity, flux residues, vibration and long-term aging. ADHPROM™ Adhesion Promoters are organofunctional silane-based coupling agents designed to strengthen bonding between coating resins and electronic substrates such as metals, glass, ceramics, FR-4 laminates and mineral-filled plastics. By forming chemical bridges at the interface, ADHPROM helps improve coating integrity, reduces under-film corrosion risk, and enhances reliability in harsh service environments.
ADHPROM additives are typically used at low dosages and are compatible with many electronics coating chemistries including epoxy, polyurethane, acrylic, silicone-modified systems and hybrid inorganic coatings. They are especially valuable when coatings are applied on mixed substrates, or where surface energy, contamination or moisture can otherwise lead to poor wetting and premature delamination.
ADHPROM-E3110 is an epoxy-functional silane adhesion promoter designed for electronics coatings, potting compounds and sealants where durable adhesion and moisture resistance are critical. It improves chemical bonding between organic resins and inorganic surfaces by forming a siloxane network on the substrate while presenting reactive epoxy functionality toward the resin matrix. This dual reactivity enhances interfacial strength, supports long-term adhesion after humidity exposure, and improves resistance to edge-lift and micro-delamination. ADHPROM-E3110 also promotes better substrate wetting, enabling more uniform film formation on difficult surfaces. It is suitable for use in epoxy-based coatings and also as a performance booster in acrylic and polyurethane systems where enhanced anchoring is required.
Epoxy-functional organosilane coupling agent for enhanced adhesion of electronics coatings to inorganic and metal-oxide surfaces.
Clear liquid
Reactive silane; compatible with many organic solvents and resin systems
0.2 – 2.0% on total formulation (optimize by trials)
Improves anchoring of coatings on FR-4, solder mask, exposed copper, component bodies and mixed substrate surfaces—reducing edge-lift and peeling after humidity and thermal cycling.
Enhances bonding between potting resin and housings, connectors, ceramic packages and metal components. Helps reduce interfacial void growth and moisture ingress over time.
Improves adhesion on glass, aluminum, stainless steel and plated substrates, supporting stronger bond strength and improved durability under vibration and thermal shock.
Can be used in primer systems to improve wetting and adhesion on low-energy or contaminated surfaces (after appropriate cleaning).
| Parameter | Specification |
|---|---|
| Product Name | ADHPROM™-E3110 |
| Chemical Type | Epoxy-functional organosilane |
| Typical Chemical Name | γ-Glycidoxypropyltrimethoxysilane (GPTMS-type) |
| CAS Number | 2530-83-8 |
| Molecular Formula | C₉H₂₀O₅Si |
| Appearance | Clear, colorless to pale yellow liquid |
| Odor | Mild characteristic |
| Purity | ≥ 97 % |
| Density (25 °C) | 1.06 – 1.08 g/cm³ |
| Viscosity (25 °C) | 3 – 6 mPa·s |
| Flash Point | ~110 °C (closed cup) |
| Solubility | Soluble in alcohols, ketones, aromatic solvents; hydrolyzes in water |
| Hydrolysis Behavior | Moisture-reactive; forms silanol groups |
| Functional Group | Epoxy (glycidyl) |
| Recommended Dosage | 0.2 – 2.0 % (on total formulation) |
| Compatibility | Epoxy, polyurethane, acrylic, hybrid & polysilazane systems |
| Film Effect | Improves adhesion, wetting and interfacial bonding |
| Application Temperature | Ambient to moderate heat curing |