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Boron Nitride – Grade GPBN-1005

A high-purity, ultra-fine hexagonal boron nitride (h-BN) powder (1–5 μm) engineered for advanced thermal management, lubrication additives, and high-temperature coating applications. Its optimized particle size delivers exceptional thermal conductivity, smooth surface finish, and outstanding dispersion—ideal for high-performance formulations in thermal greases, high-temperature lubricants, release coatings, electronic encapsulants, advanced ceramics, and polymer compounding.

Its ultra-fine structure ensures uniform integration even in low-viscosity systems, enhancing stability and performance across diverse matrices. GPBN-1005 also offers superior oxidation resistance, chemical inertness, and low dielectric constant, making it an excellent choice for electronics, automotive, aerospace, and engineering plastics. It is highly recommended for industries requiring consistent quality, long-term durability, and high-performance functional fillers.

General Characteristics

Synonyms

BN,h-BN, White Graphite

Molecular Weight

 24.82 g/mol

CAS No.

10043-11-5

EC / EINECS No.

233-136-6

HS Code

2850 00 20

UN / Transport

Not regulated (non-hazardous solid)

Form

White, odorless crystalline powder

Purity (typical)

>99%

Crystal Structure

Hexagonal

True Density

2.20–2.30 g/cm³

Mohs Hardness

~2 (soft, lubricious)

Max Use Temp

>1800–2000 °C

Applications

Thermally Conductive, Electrically Insulating Filler

Boosts heat dissipation in epoxies, silicones, and potting compounds while preserving dielectric strength for LEDs, EV power modules, and RF devices.

High-Temperature Dry Lubricant

Provides clean, non-carbonizing lubrication up to ~900 °C in air (higher in inert atmospheres), reducing friction in bearings, slides, and sintering fixtures.

Non-Wetting Release Agent for Molten Metals & Glass

Forms a chemically inert barrier that resists wetting by aluminum, magnesium, and glass, enabling easy release of casts, billets, and glassware.

Mold-Coating & Die-Coating Additive

Creates thermally stable, low-friction surfaces on dies and molds to minimize soldering/pick-up, improve surface finish, and extend tool life.

Thermal Interface & Gap-Filler Enhancer

In TIM pads, greases, and gels, platelets align to create heat-spreading pathways without adding electrical conductivity.

Coating Pigment for Low Friction & Anti-Sticking Surfaces

Disperses into binders to yield smooth, low-energy surfaces on chutes, hoppers, and cutting tools for clean release and easier cleanup.

Refractory Wash & Crucible Dressing Component

Protects graphite and ceramic refractories from attack and sticking in foundries, brazing, and high-temp heat-treating lines.

Polymer & Elastomer Performance Additive

Lowers density and mold shrinkage, improves abrasion resistance, and adds slip in engineering thermoplastics, PU, and elastomers.

Cosmetic & Personal-Care Texturizer

Provides silky slip, optical soft focus, and sebum control in premium skin-care and color formulations.

Property Unit Typical Values
Product NameBoron Nitride Powder
Grade Ref.GPBN 1005
Crystal StructureHexagonal, Flakes, Spherical
BN Puritywt %≥ 99%
B₂O₃ Contentwt %≤ 0.5–1.0%
Oxygen Contentwt %≤ 1.0–2.0%
Typical Impurities (Fe, Ca, Si, etc.)ppm≤ 100–300 ppm
Particle Size Rangeµm1–3 µm
Specific Surface Area (BET)m²/g6–8 m²/g
Densityg/cm³2.25 g/cm³
Moisture Contentwt %≤ 0.2–0.5%
Loss on Ignition (LOI, 1000°C)wt %≤ 1.0–2.0%
ColorWhite
OdorOdorless
pH (aqueous slurry)7–9
Thermal Conductivity (in-plane)W/m·K300–400 W/m·K
Coefficient of Thermal Expansion10⁻⁶/K1–4 (in-plane); 30–40 (through-plane)
Electrical ResistivityΩ·cm≥ 10¹² Ω·cm (at RT, dry)
Dielectric Constant (1 MHz)3–4
Dielectric StrengthkV/mm15–30 kV/mm (dense body)
Maximum Use Temperature (Air)°C900–1000°C
Maximum Use Temperature (Inert)°CUp to 1800°C
Coefficient of Friction (BN film)0.15–0.25
SolubilityInsoluble in water & most solvents
Chemical ResistanceExcellent vs. most acids & molten metals

Benefits

Superior Thermal Conductivity

Enables efficient heat dissipation in polymers and electronics.

Electrical Insulation

Excellent for high-voltage and semiconductor applications.

Exceptional Lubricity

Reduces friction under high pressure and temperature.

Chemical Inertness

Stable against acids, alkalis, and molten metals.

Thermal Stability

Performs reliably up to 900 °C in air and 2000 °C in inert atmospheres.

Non-Wetting Surface

Prevents adhesion of molten metals and glass.

Low Dielectric Constant

Ideal for high-frequency and dielectric applications

Safety & Hazard Information – Boron Nitride (BN) Powder

Flammability

Non-flammable and non-explosive.
Does not support combustion.

Reactivity

Stable under normal conditions.
May react with strong oxidizing agents or halogens at elevated temperatures.

Inhalation Hazard

Fine powder may cause mechanical irritation to the respiratory tract.
Prolonged inhalation of dust should be avoided.

Chronic Exposure

Long-term exposure to airborne dust could lead to respiratory discomfort or dryness but no known systemic toxicity.

Personal Protective Equipment (PPE)

Use dust mask or NIOSH-approved respirator.
Wear protective gloves, safety goggles, and suitable lab clothing.
Use local exhaust or general ventilation to minimize airborne dust.

Spill & Leak Procedures:

Avoid creating airborne dust.
Sweep up material gently and collect in labeled container for disposal.
Do not wash to drain.

Storage Conditions

Store in a cool, dry, well-ventilated area. Keep container tightly closed to prevent moisture absorption or contamination.

Firefighting Measures

Use extinguishing media suitable for surrounding fire (BN itself is non-combustible).
Firefighters should wear self-contained breathing apparatus (SCBA) if powders are airborne.

Transport Information:

Not classified as dangerous goods (per UN, DOT, IMO, IATA).
Safe for transport under general conditions.

Storage & Handling Guidelines

Storage Conditions

Store in a cool, dry, and well-ventilated area away from moisture and direct sunlight.
Maintain ambient temperatures below 40 °C and relative humidity below 60%.
Avoid exposure to high humidity, as moisture can cause powder clumping and affect flow properties.

Container Requirements

Keep material in tightly sealed containers made of plastic, fiber drum, or lined metal.
Reseal opened containers immediately after use to prevent contamination and moisture absorption.
Clearly label containers with product name and batch number.

Segregation

Store away from strong oxidizers, acids, or halogen compounds that could react under high temperature.
Avoid storing near combustible materials even though BN is non-flammable.

Handling Precautions

Handle powders in a dust-controlled area or under local exhaust ventilation.
Avoid generating airborne dust during transfer or mixing.
Use clean, dry tools to prevent contamination

Packaging Information – Boron Nitride Powders

Standard Packaging

Supplied in 5 Kg and 25 Kg HDPE drums, fiber drums, or laminated kraft paper bags

Bulk Packaging (for industrial users):

Available in 500 kg or 1000 kg jumbo bags (FIBCs) with moisture-barrier inner liners.
Palletized and shrink-wrapped for stability and safe handling during transport.

Custom Packaging Options

Smaller packs (e.g., 1 kg) available for R&D or laboratory use.
Customized labeling and private branding offered upon request.

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