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FLINK 7200 is an engineered hydrofluoroether (HFE-7200) specialty fluid developed for precision cleaning, vapor degreasing, rinsing, and dielectric-safe processing in electronics and high-value manufacturing.
FLINK 7200 is based on ethoxy-nonafluorobutane (C₄F₉OC₂H₅), it delivers fast wetting, controlled evaporation, and ultra-low residue performance—ideal for removing light oils, fingerprints, particulates, and fluorinated soils from complex parts and assemblies. Its low surface tension helps the fluid penetrate tight clearances, micro-gaps, and intricate geometries, improving cleaning coverage and rinse-out efficiency.
With a stable boiling point (~76 °C), FLINK 7200 supports repeatable vapor degreasing cycles and consistent drying behavior. The fluid is non-conductive and offers strong dielectric properties, making it suitable around sensitive electronics, connectors, and electrical components where water-based or conductive cleaners are not acceptable. It is non-flammable, low odor, and chemically stable, supporting safer plant handling and reliable long-term performance.
FLINK 7200 is also positioned as a modern alternative to ozone-depleting and certain legacy high-impact fluids, offering zero ozone depletion potential (ODP) and a reduced environmental profile. Beyond cleaning, it is used as a carrier solvent for lubricant deposition, and as a specialty medium in extraction, dispersion, and reaction workflows where controlled volatility and clean evaporation are required.
Hydrofluoroether (HFE-7200)
Ethoxy-nonafluorobutane
C₄F₉OC₂H₅
163702-06-5 and 163702-05-4 (inseparable isomers)
≥ 99.0%
≤ 1.0 ppm
Vapor degreasing solvent for cleaning and rinsing stages
Cold cleaning / wipe solvent for sensitive parts and flex circuits
Spray contact cleaner for electronics and electromechanical components
Light-duty cleaning (neat) for particulates, fluorolubes, light oils, fluoropolymers
Lubricant carrier for controlled deposition / transport and uniform spreading
Dispersion medium for select chemistries
Extraction solvent for targeted removal steps
Reaction/process medium where clean evaporation and low residue matter
Heat-transfer fluid use in specific thermal management workflows
| Property | Unit | Typical Value |
|---|---|---|
| Boiling point (1 atm) | °C | 34 |
| Freeze / pour point | °C | –122 |
| Molecular weight | g/mol | 200 |
| Vapor pressure | kPa | 65 |
| Latent heat of vaporization | kJ/kg | 142 |
| Liquid density | kg/m³ | 1400 |
| Kinematic viscosity (25 °C) | cSt | 0.32 |
| Kinematic viscosity (–80 °C) | cSt | 2.0 |
| Kinematic viscosity (–120 °C) | cSt | 17 |
| Specific heat | J·kg⁻¹·K⁻¹ | 1300 |
| Thermal conductivity | W·m⁻¹·K⁻¹ | 0.075 |
| Surface tension | dyn/cm | 12.4 |
| Dielectric strength (0.1” gap) | kV | > 25 |
| Dielectric constant | — | 7.4 |
Achieves surface tension below 20 mN/m, enabling rapid wetting and perfect film formation even on very low-energy substrates.
Ensures excellent coverage on PE, PP, PTFE, EVA, rubber, oily surfaces, and contaminated substrates where conventional surfactants fail.
Eliminates defects like fisheyes, orange peel, and crater formation by improving flow and spreading in both water-borne and solvent-borne systems.
Shows >10% solubility in water, alcohols, ketones, esters, and aromatics—ensuring easy incorporation into diverse coating systems.
Delivers strong performance at 0.05–0.1%, reducing formulation cost while providing superior wetting and flow characteristics.
Compatible with acrylics, PU, epoxy, UV systems, inks, adhesives, and resin blends without interfering with curing or recoatability.
Boosts primer and topcoat adhesion on EVA, plastics, rubber goods, and difficult polymer surfaces by enabling uniform substrate wetting.
Maintains strong wetting performance in harsh processing conditions, high-solids systems, and elevated temperatures.
Improves print sharpness, coating uniformity, and film smoothness by minimizing pinholes, micro-bubbles, and surface irregularities.
Ensures uniform film spread and defect-free leveling even in fast-curing or high-viscosity formulations.
FLINK 7200 is generally compatible with most metals and many plastics, making it useful for mixed-material assemblies. For soft plastics and elastomers, compatibility can vary depending on plasticizer content and exposure time/temperature. In sensitive systems, validate with your exact materials, especially for seals, O-rings, gaskets, and adhesive-bonded parts. Some fluorinated plastics and elastomers may absorb fluorinated fluids over long exposures—so testing under real operating conditions is recommended.
0.00
55
0.77 years
200 ppm
Supplied in 20 kg pails with sealed lids to ensure product stability and prevent contamination during storage and handling.
Available in 1 kg and 5 kg packs for laboratory use, sampling, R&D trials, and small-scale production requirements.